Files
MyOwnEtherCATDevice/Kicad/Ax58100-stm32-ethercat/Ax58100-stm32-ethercat-job.gbrjob
2024-01-10 15:30:41 +01:00

170 lines
3.9 KiB
Plaintext
Executable File

{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "7.0.9"
},
"CreationDate": "2024-01-09T22:49:01+01:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "Ax58100-stm32-ethercat",
"GUID": "41783538-3130-4302-9d73-746d33322d65",
"Revision": "rev?"
},
"Size": {
"X": 94.688,
"Y": 59.382
},
"LayerNumber": 4,
"BoardThickness": 1.6,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.15,
"MinLineWidth": 0.2,
"TrackToRegion": 0.5,
"RegionToRegion": 0.5
},
{
"Layers": "Inner",
"PadToPad": 0.0,
"PadToTrack": 0.0,
"TrackToTrack": 0.15,
"TrackToRegion": 0.5,
"RegionToRegion": 0.5
}
],
"FilesAttributes": [
{
"Path": "Ax58100-stm32-ethercat-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-GND_Cu.gbr",
"FileFunction": "Copper,L2,Inr",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-Power_Cu.gbr",
"FileFunction": "Copper,L3,Inr",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-B_Cu.gbr",
"FileFunction": "Copper,L4,Bot",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-F_Paste.gbr",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-B_Paste.gbr",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "Ax58100-stm32-ethercat-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "Ax58100-stm32-ethercat-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "Ax58100-stm32-ethercat-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "F.Cu/GND.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to GND.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "GND.Cu"
},
{
"Type": "Dielectric",
"Thickness": 1.24,
"Material": "FR4",
"Name": "GND.Cu/Power.Cu",
"Notes": "Type: dielectric layer 2 (from GND.Cu to Power.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "Power.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "Power.Cu/B.Cu",
"Notes": "Type: dielectric layer 3 (from Power.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}