170 lines
3.9 KiB
Plaintext
Executable File
170 lines
3.9 KiB
Plaintext
Executable File
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "7.0.9"
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},
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"CreationDate": "2024-01-09T22:49:01+01:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "Ax58100-stm32-ethercat",
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"GUID": "41783538-3130-4302-9d73-746d33322d65",
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"Revision": "rev?"
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},
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"Size": {
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"X": 94.688,
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"Y": 59.382
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},
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"LayerNumber": 4,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.5,
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"RegionToRegion": 0.5
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},
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{
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"Layers": "Inner",
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"PadToPad": 0.0,
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"PadToTrack": 0.0,
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"TrackToTrack": 0.15,
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"TrackToRegion": 0.5,
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"RegionToRegion": 0.5
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}
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],
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"FilesAttributes": [
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{
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"Path": "Ax58100-stm32-ethercat-F_Cu.gbr",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Ax58100-stm32-ethercat-GND_Cu.gbr",
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"FileFunction": "Copper,L2,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Ax58100-stm32-ethercat-Power_Cu.gbr",
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"FileFunction": "Copper,L3,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Ax58100-stm32-ethercat-B_Cu.gbr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Ax58100-stm32-ethercat-F_Paste.gbr",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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{
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"Path": "Ax58100-stm32-ethercat-B_Paste.gbr",
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{
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{
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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{
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"Path": "Ax58100-stm32-ethercat-B_Mask.gbr",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "Ax58100-stm32-ethercat-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.1,
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"Material": "FR4",
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"Name": "F.Cu/GND.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to GND.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "GND.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.24,
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"Material": "FR4",
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"Name": "GND.Cu/Power.Cu",
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"Notes": "Type: dielectric layer 2 (from GND.Cu to Power.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "Power.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.1,
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"Material": "FR4",
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"Name": "Power.Cu/B.Cu",
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"Notes": "Type: dielectric layer 3 (from Power.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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