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Two-layer now

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This commit is contained in:
Hakan Bastedt
2024-01-25 00:30:19 +01:00
parent e641fd04b7
commit aa955aec67
2 changed files with 2 additions and 7 deletions
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1
Kicad/Ax58100-stm32-ethercat/.gitignore vendored
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@@ -4,3 +4,4 @@ fp-info-cache
\#auto_saved_file*
gerbers/
Ax58100-stm32-ethercat-backups/
freerouting.*

8
Kicad/Ax58100-stm32-ethercat/Ax58100-stm32-ethercat.kicad_pcb
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@@ -7,8 +7,6 @@
(paper "A4")
(layers
(0 "F.Cu" signal)
(1 "In1.Cu" power "GND.Cu")
(2 "In2.Cu" power "Power.Cu")
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
@@ -45,11 +43,7 @@
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "core") (thickness 1.24) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))