jeka/MyOwnEtherCATDevice
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Two-layer now

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Hakan Bastedt committed 2024-01-25 00:30:19 +01:00
1 parent e641fd04b7
commit aa955aec67
2 files changed
+2 -7
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Kicad/Ax58100-stm32-ethercat/.gitignore
+1
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@@ -4,3 +4,4 @@ fp-info-cache
\#auto_saved_file* \#auto_saved_file*
gerbers/ gerbers/
Ax58100-stm32-ethercat-backups/ Ax58100-stm32-ethercat-backups/
freerouting.*
Kicad/Ax58100-stm32-ethercat/Ax58100-stm32-ethercat.kicad_pcb
+1 -7
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@@ -7,8 +7,6 @@
(paper "A4") (paper "A4")
(layers (layers
(0 "F.Cu" signal) (0 "F.Cu" signal)
(1 "In1.Cu" power "GND.Cu")
(2 "In2.Cu" power "Power.Cu")
(31 "B.Cu" signal) (31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive") (32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive") (33 "F.Adhes" user "F.Adhesive")
@@ -45,11 +43,7 @@
(layer "F.Paste" (type "Top Solder Paste")) (layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01)) (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035)) (layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "core") (thickness 1.24) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035)) (layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01)) (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste")) (layer "B.Paste" (type "Bottom Solder Paste"))