Two-layer now

This commit is contained in:
Hakan Bastedt
2024-01-25 00:30:19 +01:00
parent e641fd04b7
commit aa955aec67
2 changed files with 2 additions and 7 deletions

View File

@@ -4,3 +4,4 @@ fp-info-cache
\#auto_saved_file* \#auto_saved_file*
gerbers/ gerbers/
Ax58100-stm32-ethercat-backups/ Ax58100-stm32-ethercat-backups/
freerouting.*

View File

@@ -7,8 +7,6 @@
(paper "A4") (paper "A4")
(layers (layers
(0 "F.Cu" signal) (0 "F.Cu" signal)
(1 "In1.Cu" power "GND.Cu")
(2 "In2.Cu" power "Power.Cu")
(31 "B.Cu" signal) (31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive") (32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive") (33 "F.Adhes" user "F.Adhesive")
@@ -45,11 +43,7 @@
(layer "F.Paste" (type "Top Solder Paste")) (layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01)) (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035)) (layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "core") (thickness 1.24) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035)) (layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01)) (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste")) (layer "B.Paste" (type "Bottom Solder Paste"))